| 发明名称 |
ASSEMBLY PROCESS OF TWO SUBSTRATES |
| 摘要 |
A method for assembling two substrates by molecular adhesion comprises: a first step (a) of putting first and second substrates in close contact in order to form an assembly having an assembly interface; a second step (b) of reinforcing the degree of adhesion of the assembly beyond a threshold adhesion value at which water is no longer able to diffuse along the assembly interface. The method also comprises a step (c) of anhydrous treatment of the first and second substrates in a treatment atmosphere having a dew point below −10° C., and control of the dew point of a working atmosphere to which the first and second substrates are exposed from the anhydrous treatment step (c) until the end of the second step (b) so as to limit or prevent the appearance of bonding defects at the assembly interface. |
| 申请公布号 |
US2016152017(A1) |
申请公布日期 |
2016.06.02 |
| 申请号 |
US201514947254 |
申请日期 |
2015.11.20 |
| 申请人 |
Soitec ;Commissariat A L'Energie Atomique et aux Energies Alternatives |
发明人 |
Landru Didier;Delage Capucine;Fournel Franck;Beche Elodie |
| 分类号 |
B32B37/00;H01L21/324;H01L21/762;B32B38/00 |
主分类号 |
B32B37/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of assembling two substrates by molecular adhesion, comprising:
a first step (a) of putting a first substrate and a second substrate in close contact in order to form an assembly having an assembly interface; a second step (b) of reinforcing the degree of adhesion of the assembly beyond a threshold adhesion value at which water is no longer able to diffuse along the assembly interface; a step (c) of anhydrous treatment of the first and second substrates in a treatment atmosphere having a dew point below −10° C.; and control of the dew point of a working atmosphere to which the first and second substrates are exposed from the anhydrous treatment step (c) until the end of the second step (b) so as to limit or prevent the appearance of bonding defects at the assembly interface. |
| 地址 |
Bernin FR |
