| 摘要 |
PROBLEM TO BE SOLVED: To provide a sheet-like resin composition, a laminate sheet having the same, and a manufacturing method of a semiconductor device, capable of sufficiently suppressing a void at an interface between an adherend and the sheet-like resin composition, and also suppressing excessive squeeze-out at the time of mounting.SOLUTION: A thermosetting sheet-like resin composition is configured to fill a void between an adherend and a semiconductor element electrically connected to the adherend. In the sheet-like resin composition, minimum melting viscosity at 80-200°C before thermal setting is 2000 Pa s or more. If an entire calorific value is Qt in a temperature rise process from -10°C to 350°C at a rate of 10°C/min in DSC measurement and a calorific value is Qh a heating process in which heating is carried out at 250°C for 10 seconds, a reaction rate R expressed by an equation below is 50% or less: R={(Qt-Qh/Qt)}×100(%).SELECTED DRAWING: Figure 1D |
