发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board that can accurately read a two-dimensional code and has excellent heat-resistance reliability where peeling does not occur to a solid pattern formed of a conductor layer of an outermost surface layer that is arranged in an area corresponding to the two-dimensional code.SOLUTION: There is provided a wiring board including an insulating board 1 having conductor layers 2 on the inside and a surface, and a solder resist layer 3 that is attached to the surface of the insulating board 1, where the surface of the solder resist layer 3 is subjected to laser processing to form a two-dimensional code 4. A solid pattern 5 formed of the conductor layer 2 is formed on the surface of the insulating board 1 in an area corresponding to the two-dimensional code 4, and the solid pattern 5 and the conductor layers 2 on the inside are connected to each other by a plurality of via conductors 6 formed integrally with the solid pattern 5.SELECTED DRAWING: Figure 1
申请公布号 JP2016103587(A) 申请公布日期 2016.06.02
申请号 JP20140241764 申请日期 2014.11.28
申请人 KYOCERA CIRCUIT SOLUTIONS INC 发明人 TOMOSAWA SHINYA;NAKAYAMA MASASHI
分类号 H05K1/02 主分类号 H05K1/02
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