JOINING METHOD, PROGRAM, COMPUTER RECORDING MEDIUM, JOINING APPARATUS AND JOINING SYSTEM

摘要

The present invention is to test a state of a bonding process for a board and to properly perform the bonding process. A bonding method according to the present invention comprises the steps of: (step S11) making an upper wafer, which is hold and supported on a lower surface of an upper chuck, arranged to face a lower wafer, which is hold and supported on an upper surface of a lower chuck; (step S12) pressurizing the center of the upper wafer and the center of the lower wafer via a related actuator by lowering the actuator so as to come into contact with each other; (step S13) spreading the bonding between the upper wafer and the lower wafer from the center to an outer surface thereof, in a state in which the center of the upper wafer contacts the center of the lower wafer; (step S14) stopping the vacuumization of the outer surface of the upper wafer by the upper chuck; (step S15) and allowing the upper wafer and the lower wafer to be bonded. From step S11 to step S15, a state of a boding process is tested by detecting a current value of an operation unit of a first lower check transfer unit.