发明名称 |
CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
In a hybrid integrated circuit device of the present invention, leads are fixedly attached on the upper surface of a circuit board. The lead includes an island portion, a slope portion, and a lead portion. A transistor and a diode are mounted on the upper surface of the island portion. Electrodes provided on the upper surfaces of the transistor and the diode are connected to a bonding portion through a fine metal wire. The bonding portion of the lead is disposed at a higher position than the island portion. Thus, the fine metal wires connected to the bonding portion are separated from each other.
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申请公布号 |
US2012075816(A1) |
申请公布日期 |
2012.03.29 |
申请号 |
US201113242202 |
申请日期 |
2011.09.23 |
申请人 |
MASHIMO SHIGEKI;HORIUCHI FUMIO;KUDO KIYOAKI;SAKURAI AKIRA;INAGAKI YUHKI;ON SEMICONDUCTOR TRADING, LTD. |
发明人 |
MASHIMO SHIGEKI;HORIUCHI FUMIO;KUDO KIYOAKI;SAKURAI AKIRA;INAGAKI YUHKI |
分类号 |
H05K7/00;H05K3/00 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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