METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board with a low manufacturing cost and excellent solder wettability, and a method of manufacturing the same.SOLUTION: A method of manufacturing a printed circuit board 1 comprises: a paste application step of applying a conductive paste 20 including metal powder 21, a resin binder and a solvent on a surface of a resin base material 10; a temporary drying step of forming a solvent removal paste layer 30 on the resin base material 10 by evaporating the solvent from the conductive paste 20; an ultrasonic oscillation and compression step for forming an ultrasonic oscillation and compression layer 40 on the resin base material 10 by applying ultrasonic oscillation to the solvent removal paste layer 30 and compressing the surface of the solvent removal paste layer 30; and a calcination step of forming a circuit body 50 on the resin base material 10 by calcining the ultrasonic oscillation and compression layer 40.SELECTED DRAWING: Figure 12