发明名称 |
METHOD FOR LAMINATING TWO SUBSTRATES |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for laminating two substrates (1, 2) by molecular adhesion.SOLUTION: A method for laminating two substrates by molecular adhesion includes: a first step (a) of putting a first substrate (1) and a second substrate (2) in close contact to form a lamination (3) having a lamination interface (4); and a second step (b) of reinforcing the degree of adhesion of the lamination (3) beyond a threshold adhesion value at which water is no longer able to diffuse along the lamination interface (4). According to the present invention, the method also includes: a step (c) of subjecting the first and second substrates (1, 2) to anhydrous treatment in a treatment atmosphere having a dew point below 10°C; and controlling the dew point of a working atmosphere to which the first and second substrates (1, 2) are exposed from the step (c) performing anhydrous treatment until the end of the second step (b) so as to limit or prevent the appearance of bonding defects at the lamination interface.SELECTED DRAWING: Figure 7 |
申请公布号 |
JP2016103637(A) |
申请公布日期 |
2016.06.02 |
申请号 |
JP20150227657 |
申请日期 |
2015.11.20 |
申请人 |
SOYTEC;COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
发明人 |
DIDIER LANDRU;CAPUCINE DELAGE;FRANCK FOURNEL;ELODIE BECHE |
分类号 |
H01L21/02;B23K20/00;B23K20/24 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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