SUBSTRATE BONDING DEVICE, SUBSTRATE BONDING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD

摘要

In the present invention a first substrate and a second substrate are bonded to each other with an adhesive layer therebetween. A first roller presses the second substrate against the first substrate while the second substrate is subjected to bending deformation and, while rolling, the first roller applies the entire surface of the second substrate to the first substrate by means of a first force. A second roller, while rolling, applies a second force that is greater than the first force to the laminated body formed by the application of the entire surface of the second substrate to the first substrate, thereby pressure bonding the entire surface of the second substrate to the first substrate.