发明名称 THERMALLY CONDUCTIVE ADHESIVE COMPOSITION AND THERMALLY CONDUCTIVE ADHESIVE THIN SHEET THEREFROM
摘要 The present invention relates to a thermally conductive adhesive composition, capable of improving heat conductivity and minimizing delamination by hardening shrinkage, and to a thermally conductive thin film adhesive sheet manufactured therefrom. Disclosed is a thermally conductive adhesive composition for the same, comprising an acrylic-based resin, a thermally hardening agent, and at least two types of thermally conductive fillers.
申请公布号 KR20160061803(A) 申请公布日期 2016.06.01
申请号 KR20140164684 申请日期 2014.11.24
申请人 TORAY ADVANCED MATERIALS KOREA INC. 发明人 KIM, JAE HOON;CHOI, SUNG HWAN;LEE, MOON BOK
分类号 C09J9/00;C09J7/00;C09J11/04;C09J133/06 主分类号 C09J9/00
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