发明名称 |
THERMALLY CONDUCTIVE ADHESIVE COMPOSITION AND THERMALLY CONDUCTIVE ADHESIVE THIN SHEET THEREFROM |
摘要 |
The present invention relates to a thermally conductive adhesive composition, capable of improving heat conductivity and minimizing delamination by hardening shrinkage, and to a thermally conductive thin film adhesive sheet manufactured therefrom. Disclosed is a thermally conductive adhesive composition for the same, comprising an acrylic-based resin, a thermally hardening agent, and at least two types of thermally conductive fillers. |
申请公布号 |
KR20160061803(A) |
申请公布日期 |
2016.06.01 |
申请号 |
KR20140164684 |
申请日期 |
2014.11.24 |
申请人 |
TORAY ADVANCED MATERIALS KOREA INC. |
发明人 |
KIM, JAE HOON;CHOI, SUNG HWAN;LEE, MOON BOK |
分类号 |
C09J9/00;C09J7/00;C09J11/04;C09J133/06 |
主分类号 |
C09J9/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|