Ceramic electronic component and method for manufacturing ceramic electronic component

摘要

A ceramic electronic component includes a ceramic body and first and second outer electrodes. The first and second outer electrodes respectively include first and second resin-containing electrode layers and first and second Ni plating layers. The first and second Ni plating layers are respectively provided on the first and second resin-containing electrode layers. When a thickness of the first or second Ni plating layer is t1 and a distance by which a portion of the first or second Ni plating layer that is in contact with the second principal surface extends in the length direction is t2, t2/t1 is less than about 1.

主权项

1. A ceramic electronic component comprising:
a ceramic body including first and second principal surfaces that extend in a length direction and a width direction, first and second side surfaces that extend in the length direction and a thickness direction, and first and second end surfaces that extend in the width direction and the thickness direction; and an outer electrode arranged so as to extend from the first end surface of the ceramic body to the second principal surface of the ceramic body; wherein the outer electrode includes:
a resin-containing electrode layer provided on the ceramic body and containing a conductive material and a resin; anda plating layer provided on the resin-containing electrode layer, the plating layer including a Ni plating layer; wherein when a thickness of the Ni plating layer is t1 and a distance by which a portion of the Ni plating layer that is in contact with the second principal surface extends in the length direction is t2, t2/t1 is less than about 1.