发明名称 Overlay displacement amount measuring method, positional displacement amount measuring method and positional displacement amount measuring apparatus
摘要 In an overlay displacement amount measuring method according to an embodiment, a temperature distribution of a substrate during a pattern forming process and a temperature distribution of the substrate during a measuring process for measuring a positional displacement amount between patterns on the substrate by an electron microscope are measured. An expansion/contraction amount of the substrate between two processes is calculated based upon the two temperature distributions, and the positional displacement amount is corrected based upon the expansion/contraction amount. An overlay displacement amount between the pattern and a pattern formed on a layer different from the pattern is measured by an optical measuring apparatus, and the overlay displacement amount is corrected based upon the corrected positional displacement amount.
申请公布号 US9354527(B2) 申请公布日期 2016.05.31
申请号 US201314075044 申请日期 2013.11.08
申请人 Kabushiki Kaisha Toshiba 发明人 Sato Hidenori;Komine Nobuhiro
分类号 G03F7/20;G03F9/00 主分类号 G03F7/20
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P.
主权项 1. An overlay displacement amount measuring method comprising: measuring a first temperature distribution of a substrate during a first process that is a process of forming a first pattern on the substrate; measuring a first positional displacement amount between the first patterns by a first electron microscope; measuring a second temperature distribution of the substrate during a second process that is a process of measuring the first positional displacement amount; calculating a first expansion/contraction amount of the substrate between the first process and the second process based upon the first temperature distribution and the second temperature distribution; correcting the first positional displacement amount based upon the first expansion/contraction amount; measuring an overlay displacement amount between the first pattern and a second pattern formed on a layer different from the first pattern by a first optical measuring apparatus; and correcting the overlay displacement amount based upon the corrected first positional displacement amount.
地址 Minato-ku JP