发明名称 Structure and formation method of memory device
摘要 Structures and formation methods of memory devices are provided. The memory device includes a first electrode, a second electrode, and a resistive layer positioned between the first electrode and the second electrode. The resistive layer has a crystalline portion. A volume ratio of the crystalline portion to the resistive layer is in a range from about 0.2 to about 1.
申请公布号 US9356235(B2) 申请公布日期 2016.05.31
申请号 US201414474931 申请日期 2014.09.02
申请人 Winbond Electronics Corp. 发明人 Hsu Po-Yen;Liao Hsiu-Han;Chang Shuo-Che;Ho Chia Hua
分类号 H01L45/00 主分类号 H01L45/00
代理机构 Muncy, Geissler, Olds & Lowe, P.C. 代理人 Muncy, Geissler, Olds & Lowe, P.C.
主权项 1. A memory device, comprising: a first electrode; a second electrode; and a resistive layer positioned between the first electrode and the second electrode, wherein the resistive layer has a crystalline portion, and a volume ratio of the crystalline portion to the resistive layer is in a range from about 0.2 to about 1.
地址 Taichung TW