MEMS devices and methods for forming same

摘要

An embodiment is MEMS device including a first MEMS die having a first cavity at a first pressure, a second MEMS die having a second cavity at a second pressure, the second pressure being different from the first pressure, and a molding material surrounding the first MEMS die and the second MEMS die, the molding material having a first surface over the first and the second MEMS dies. The device further includes a first set of electrical connectors in the molding material, each of the first set of electrical connectors coupling at least one of the first and the second MEMS dies to the first surface of the molding material, and a second set of electrical connectors over the first surface of the molding material, each of the second set of electrical connectors being coupled to at least one of the first set of electrical connectors.

主权项

1. A method comprising:
forming a first microelectromechanical system (MEMS) die having a first cavity and a first substrate, the first cavity having a first pressure; forming a second MEMS die having a second cavity and a second substrate, the second cavity having a second pressure, the second pressure being different from the first pressure, the second substrate being physically disconnected from the first substrate; encapsulating the first MEMS die and the second MEMS die with a molding material, the molding material having a first surface; forming a first set of electrical connectors in the molding material, each electrical connector of the first set of electrical connectors coupling at least one of the first and the second MEMS dies to the first surface of the molding material; and forming a second set of electrical connectors over the first surface of the molding material, each electrical connector of the second set of electrical connectors being coupled to at least one electrical connector of the first set of electrical connectors.