发明名称 |
Method of forming an implantable device |
摘要 |
An implantable structure, method for making the structure and method for using the structure, where the structure includes a combination of non-absorbable and absorbable components, and the implantable structure has a randomly uniform array of materials. The resulting implantable structure provides improved tissue ingrowth and flexibility after implantation and after absorption of the absorbable materials. |
申请公布号 |
US9352071(B2) |
申请公布日期 |
2016.05.31 |
申请号 |
US201313803119 |
申请日期 |
2013.03.14 |
申请人 |
Ethicon, Inc. |
发明人 |
Landgrebe Susanne;Smith Daniel;Dick Oliver |
分类号 |
D01F6/06;D03D1/00;A61L27/40;A61L27/58;D02G3/04;D01F6/62;A61L27/16;A61L27/18;A61L27/48;A61L27/50;A61L27/56;D04B1/16 |
主分类号 |
D01F6/06 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method of forming an implantable device, comprising the steps of:
a. Forming a first yarn and a second yarn, wherein at least one of said first yarn and second yarns includes a first non-absorbable filament and at least one of said first yarn and second yarns includes a first absorbable filament, said first absorbable filament having a lower melting point than said first non-absorbable filament, and including the step of kinking at least one of said first absorbable filament and said first non-absorbable filament prior to forming said first or second yarn; b. Forming an initial woven structure comprising said first yarn and second yarn; c. Subjecting said initial woven structure to a first heat treatment at a first temperature sufficient to cause shrinkage of said first absorbable filament, and thus buckling at least the second yarn and forming an initial heated structure; d. Heating said initial heated structure to a second temperature, said second temperature being higher than said first temperature, wherein at least a portion of said first absorbable filament is melted; and e. Allowing said heated structure to cool to form a resulting implantable device. |
地址 |
Somerville NJ US |