Semiconductor device with heat-dissipating lead frame

摘要

A packaged semiconductor device has a top and a bottom and includes a lead frame, a die, and an encapsulant that encapsulates the die and most of the lead frame. The lead frame includes a die pad on which the die is mounted, leads electrically connected to the die such as with bond wires, and die pad extensions that fan out from the die pad. Each die-pad extension has a proximal segment and a distal segment. The distal segments are interleaved with the leads. The bottoms of the die pad and the proximal segments of the extensions may be exposed at the bottom of the device. The top of the device may have notches corresponding to the extensions and portions of the distal segments may be exposed and bent into corresponding ones of the notches at the top of the device.

主权项

1. An apparatus comprising a lead frame for a packaged semiconductor device, the lead frame comprising:
a die pad; a plurality of lead fingers; and a plurality of die pad extensions fanning out from one or more sides of the die pad, wherein:
each die pad extension comprises a proximal extension segment and a connected distal extension segment;the proximal extension segment fans out from the die pad; andthe distal extension segment is substantially parallel with adjacent lead fingers, and the apparatus further comprising: a die attached to the die pad and electrically connected to the lead fingers; and an encapsulant that covers the die and at least some of the lead frame, wherein:
a bottom surface of the die pad is exposed through a bottom surface of the encapsulant;the distal extension segment of each of the die pad extensions is exposed; anda top surface of the encapsulant includes notches that receive the exposed distal extension segments.