| 主权项 |
1. A system for inspecting a wafer using a reference wafer area, the system comprising:
a first input interface to obtain: calibration information including respective reference displacements of multiple frames comprised in the reference wafer area, and a target database including, for each out of at least part of multiple targets in each of at least part of the multiple frames, location information determined in design data coordinates with respect to a frame in which a given target is included, wherein an inspected wafer area and the reference wafer area are characterized by substantially similar content; a second input interface to obtain a scanned image of the inspected wafer area; a correlator to:
calculate, for each out of the at least part of multiple targets, a run-time target displacement in the design data coordinates; anddetermine, for each of at least part of multiple run-time frames, a run-time frame displacement in the inspected wafer area, the determining based on run-time target displacements calculated for multiple targets in a respective run-time frame; and a processor to:
generate, in accordance with determined run-time frame displacements, inspection data for the inspected wafer area, thereby positioning inspection data in the design data coordinates independently for each frame; andmodify, in accordance with run-time frame displacements, a comparison scheme usable for defects detection, wherein modifying the comparison scheme comprises at least one of modifying defect detection instructions pertaining to different regions within the inspected area and modifying definitions of regions to which such instructions apply. |
