| 发明名称 | Liquid discharging head and method for producing the same | ||
| 摘要 | A method for producing a liquid discharging head includes an element substrate provided with a discharge opening for discharging a liquid and a supporting member that supports the element substrate, the element substrate having a first surface and a second surface opposite to the first surface, the supporting member having a height reference surface and an element-substrate bonding surface to which the first surface is bonded with an adhesive. The method includes the steps of measuring a height h of the element-substrate bonding surface from the height reference surface; applying the adhesive to the element-substrate bonding surface; and causing the first surface to oppose the element-substrate bonding surface with the adhesive being provided therebetween, and disposing the second surface at a predetermined height m from the measured height h to harden the adhesive at a portion between the element-substrate bonding surface and the element substrate. | ||
| 申请公布号 | US9352567(B2) | 申请公布日期 | 2016.05.31 |
| 申请号 | US201514723317 | 申请日期 | 2015.05.27 |
| 申请人 | Canon Kabushiki Kaisha | 发明人 | Tsujiuchi Naoko;Kimura Satoshi;Nojo Naruyuki |
| 分类号 | B41J2/135;B41J2/14;B41J2/16 | 主分类号 | B41J2/135 |
| 代理机构 | Canon USA, Inc., IP Division | 代理人 | Canon USA, Inc., IP Division |
| 主权项 | 1. A method for producing a liquid discharging head including an element substrate that is provided with a discharge opening for discharging a liquid and a supporting member that supports the element substrate, the element substrate having a first surface and a second surface that is opposite to the first surface, the supporting member having a height reference surface and an element-substrate bonding surface to which the first surface is bonded with an adhesive, the method comprising the steps of: measuring a height h of the element-substrate bonding surface from the height reference surface; applying the adhesive to the element-substrate bonding surface; and causing the first surface to oppose the element-substrate bonding surface with the adhesive being provided therebetween, and disposing the second surface at a predetermined height m from the height h that has been measured to harden the adhesive at a portion between the element-substrate bonding surface and the element substrate. | ||
| 地址 | Tokyo JP | ||