| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing method by which a resin film cam be stuck to the backside of each chip while keeping the cost low.SOLUTION: A wafer processing method comprises: a protective member-sticking step for sticking a protective member (21) to the side of a surface (11a) of a wafer (11); a backside grinding step for grinding the backside (11b) of the wafer; a resin film-sticking step for sticking a resin film (31) to the backside of the wafer after the grinding; a scheduled division line-exposing step for partially removing the resin film to expose a region corresponding to a scheduled division line (13) of the wafer; an etching step for performing a plasma etching through the resin film to divide the wafer into chips (19); a wafer-supporting step for sticking an adhesive tape (41) to the resin film side of the divided wafer, thereby supporting an outer peripheral portion of the adhesive tape by an annular frame (43); and a protective member-peeling step for peeling the protective member from the surface side of the wafer supported by the frame.SELECTED DRAWING: Figure 5 |
