| 发明名称 |
COPPER WIRE FOR BONDING WIRE AND METHOD OF PRODUCING COPPER WIRE FOR BONDING WIRE |
| 摘要 |
This bonding-wire copper strand is used to form a bonding wire. Said copper strand is formed from highly pure copper having a purity of at least 99.9999 mass%, and has a strand diameter between 0.5 mm to 3.5 mm inclusive. The surface area ratio of the (001) plane is between 15% and 30% inclusive at a cross section perpendicular to the drawing direction. |
| 申请公布号 |
SG11201602116Y(A) |
申请公布日期 |
2016.05.30 |
| 申请号 |
SG11201602116Y |
申请日期 |
2014.09.30 |
| 申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
KUMAGAI SATOSHI;GU YU;SATO YUJI |
| 分类号 |
H01L21/60;C22C9/00;C22F1/00;C22F1/08 |
主分类号 |
H01L21/60 |
| 代理机构 |
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