EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTORS, SEMICONDUCTOR PACKAGE STRUCTURE, AND METHOD FOR MANUFACTURING SAME

摘要

An epoxy resin composition for encapsulation of semiconductors that contains (A) 100 parts by mass of epoxy resin containing 10 mass% to 45 mass% of novolac-type epoxy resin, (B) 50 parts by mass to 150 parts by mass of acid anhydride, (C) 2 parts by mass to 12 parts by mass of curing accelerator, (D) 5 parts by mass to 50 parts by mass of silicone gel or silicone oil; and (E) fused silica of average particle diameter 2 µm to 30 µm. The fused silica (E) is present in an amount that is 80 mass% to 92 mass%. The viscosity at shear rate 2.5 (1/s) at 25°C is not more than 1000 Pa·s.