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发明名称
Method for manufacturing printed circuit board using nickel plating
摘要
申请公布号
KR101041130(B1)
申请公布日期
2011.06.13
申请号
KR20080107765
申请日期
2008.10.31
申请人
发明人
分类号
H05K3/18;H05K3/06
主分类号
H05K3/18
代理机构
代理人
主权项
地址
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