| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which achieves reduction of the manufacturing costs.SOLUTION: A semiconductor device 1A includes: a substrate 100A having a major surface 101A and a recessed part 105A recessed from the major surface 101A, the substrate 100A made of a semiconductor material; a wiring part 200A at least partially formed in the substrate 100A; elements 310A, 320A, 330A housed in the recessed part 105A; and a sealing resin 400A covering at least parts of the elements 310A, 320A, 330A. The elements 310A, 320A, 330A include: the first element 310A supported by the substrate 100A; and the second element 320A supported by the first element 310A.SELECTED DRAWING: Figure 2 |
