BOND STRUCTURE, INPUT DEVICE, AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a bond structure which can bond a metal plate-like member and a resin housing member with a sufficient bonding strength at high assembly efficiency, and can suppress damage of a component; an input device using the bond structure; and electronic equipment provided with the input device.SOLUTION: A bond structure 60 has such a structure that a housing plate 50 which is a resin housing member is bonded to a base plate 26 which is a metal plate-like member in a direction of overlapping the plates. The housing plate 50 extends in a direction parallel to a coupling surface 50b with respect to the base plate 26, and includes a latch portion 56 having a pair of arm members 62 and 62 of which tip ends are separated from each other. The base plate 26 is formed vertically toward the housing plate 50 side, and includes a hook 58 for bonding which is fitted between the pair of arm members 62 and 62.SELECTED DRAWING: Figure 9