发明名称 METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS
摘要 The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
申请公布号 HK1211742(A1) 申请公布日期 2016.05.27
申请号 HK20150112349 申请日期 2015.12.16
申请人 THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOI 发明人 NUZZO, RALPH, G.;ROGERS, JOHN, A.;MENARD, ETIENNE;LEE, KEON JAE;KHANG, DAHL-YOUNG;SUN, YUGANG;MEITL, MATTHEW;ZHU, ZHENGTAO
分类号 H01L;B81C1/00;H01L21/77;H01L29/06;H01L29/786;H01L31/0312;H01L31/18 主分类号 H01L
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