AUTOMATED CLEANING OF WAFER PLATING ASSEMBLY

摘要

Disclosed herein are cleaning discs for cleaning one or more elements of a semiconductor processing apparatus. In some embodiments, the disc may have a substantially circular upper surface, a substantially circular lower surface, a substantially circular edge joining the upper and lower surfaces, and a plurality of pores opening at the edge and having an interior extending into the interior of the disc. In some embodiments, the pores are dimensioned such that a cleaning agent may be retained in the interior of the pores by an adhesive force between the cleaning agent and the interior surface of the pores. Also disclosed herein are cleaning methods involving loading a cleaning agent into a plurality of pores of a cleaning disc, positioning the cleaning disc within a semiconductor processing apparatus, and releasing cleaning agent from the plurality of pores such that elements of the apparatus are contacted by the released cleaning agent.

主权项

1. A method of cleaning one or more elements of a semiconductor holding and processing apparatus, the method comprising:
loading a cleaning agent into a cleaning disc by receiving the cleaning agent into a plurality of pores opening in one or more edges of the disc and extending into the interior of the disc; holding the cleaning agent inside the plurality of pores; positioning the cleaning disc within the processing apparatus such that the plurality of pores are adjacent to the one or more elements of the apparatus to be cleaned, the one or more elements to be cleaned normally being adjacent to a semiconductor wafer when a wafer is held in the processing apparatus for processing; and releasing cleaning agent from the plurality of pores such that the one or more elements of the apparatus to be cleaned are contacted by the released cleaning agent.