ELECTRONIC SUBSTRATE AND HEAT-DISSIPATING STRUCTURE

摘要

This invention allows for an increase in heat dissipation and a suppression of rust occurrence. The invention relates to the electronic substrate (1) having a wiring pattern (3) formed on one side of a substrate main body (2). The substrate main body (2) is configured from a copper base material (12), while the wiring pattern (3) is a copper pattern (13). The front surface of this copper pattern (13) is coated with a soldering flux (14) serving as a soldering helping agent. In addition, the back surface of the copper base material (12) is coated with a soldering flux (15) serving as a base material protecting agent.