| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip manufacturing method which makes it easy to balance inhibition of remaining adhesive layer on a surface of a semiconductor substrate and inhibition of breakage of a semiconductor chip stepped part.SOLUTION: A semiconductor chip manufacturing method comprises: a process of forming a surface side groove 400 by dry etching; a process of attaching a dicing tape having an adhesive layer 164 on a substrate surface; a process of forming from a rear face side of a substrate W, a rear face side groove 170 with a width wider than a width of the surface side groove 400, along the surface side groove 400 by a dicing blade; and a process of peeling the dicing tape after forming the rear face side groove 170. Formation of the surface side groove 400 is started at a first etching intensity where a width of the groove gradually decreases toward a depth direction, and on the way of forming the groove, the etching intensity is changed to a second etching intensity stronger than the first etching intensity, where the groove extends downward without an increase in width of the groove to form the groove having no part where the width increases.SELECTED DRAWING: Figure 7 |
