| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum processing apparatus which allows for efficient implementation of wafer processing.SOLUTION: A vacuum processing apparatus has a plurality of processing chambers 131, 132, 133, and transfer chambers 141, 142, 143 connected with the plurality of processing chambers 131, 132, 133, respectively, and including vacuum robots 121, 122, 123. Furthermore, the vacuum processing apparatus has a load lock 111 coupling the adjoining transfer chambers 141, 142, 143 and intermediate chambers 112, 113, where a plurality of transfer chambers 141, 142, 143, the load lock 111 and intermediate chambers 112, 113 are coupled alternately. The operation for carrying a wafer to each of the plurality of processing chambers 131, 132, 133, and the operation for carrying out the wafer from each of the plurality of processing chambers 131, 132, 133 are started synchronously.SELECTED DRAWING: Figure 5 |
