METHOD FOR FORMING VIA-HOLE AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a via-hole, by which a tact time can be shortened.SOLUTION: A method for forming a via-hole comprises: a resist pattern forming step for forming a pattern of resist on a circuit of a substrate with the circuit; a mask-disposing step for disposing a mask over the pattern of resist; a thermosetting resin composition coating step for coating the substrate with the circuit with a thermosetting resin composition from above the mask; a curing step for curing the thermosetting resin composition; and a resist pattern removing step for removing the pattern of resist.SELECTED DRAWING: Figure 1