COOLING DEVICE FOR ELECTRONIC COMPONENTS

摘要

A cooling device for electronic components is a combination of substrate (aluminum nitride substrate—thermoelectric elements—aluminum nitride substrate) and utilizing the temperature difference generated by two top and bottom ends of the cooling device to effectively remove the heat generated by the electronic components. This cooling device not only can effectively reduce temperature of the electronic components, but also store the power generated through its thermoelectric effect.

主权项

1. A cooling device for electronic components, comprising:
a first substrate having a first surface and a second surface, a metallized circuit being disposed on the first surface; at least one LED disposed on and electrically connected to the metallized circuit on the first surface of the first substrate; a thermoelectric element configured on the second surface of the first substrate so as to conduct heat generated by the at least one LED; a second substrate having a third surface and a fourth surface, the third surface of the second substrate coupled to the thermoelectric element so as to conduct heat to the fourth surface; a heat sink fin, disposed on the fourth surface of the second substrate to dissipate heat; and a battery coupled between the first substrate and the second substrate for storing energy generated by the cooling device, wherein the thermoelectric element comprises:
a first conductive layer comprising a plurality of first electrodes, configured on the second surface of the first substrate;a second conductive layer comprising a plurality of second electrodes, configured on the third surface of the second substrate; wherein the first substrate and the second substrate are made of an insulating ceramic material selected from one of the following group consisting of: alumina and aluminum nitride; wherein a greater a temperature difference between the first substrate and the second substrate is, a greater electric energy is so generated, and a maximum temperature difference between the first substrate and the second substrate is 74° C.; and wherein the thermoelectric element further comprises: a plurality of N-type semiconductors and a plurality of P-type semiconductors, wherein the plurality of N-type semiconductors and the plurality of P-type semiconductors are alternatively configured between the plurality of first electrodes and the plurality of second electrodes, and are coupled to the plurality of first electrodes and the plurality of second electrodes so as to form a current loop; wherein each LED has an LED chip, and each LED chip is disposed on the metallized circuit and is corresponding to each N-type semiconductor or each P-type semiconductor.