发明名称 |
METHOD FOR PRODUCING A THIN FILM TRANSISTOR |
摘要 |
A method for producing a thin film transistor includes forming a transistor prototype on a substrate, with the transistor prototype including a face having a to-be-treated portion. The to-be-treated portion of the transistor prototype is exposed in an environment full of a supercritical fluid. The supercritical fluid conducts a surface treatment on the to-be-treated portion of the transistor prototype to form a thin film transistor. The method can solve the problem of too many defects of the thin film transistor resulting from a low-temperature process. |
申请公布号 |
US2016148804(A1) |
申请公布日期 |
2016.05.26 |
申请号 |
US201414561884 |
申请日期 |
2014.12.05 |
申请人 |
NATIONAL SUN YAT-SEN UNIVERSITY |
发明人 |
Chang Ting-Chang;Tsai Ming-Yen;Chen Hua-Mao;Hsieh Tian-Yu |
分类号 |
H01L21/02;H01L29/66 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
1. A method for producing a thin film transistor, comprising:
forming a transistor prototype on a substrate, with the transistor prototype including a face having a to-be-treated portion; and exposing the to-be-treated portion of the transistor prototype in an environment full of a supercritical fluid, with the supercritical fluid conducting a surface treatment on the to-be-treated portion of the transistor prototype to form a thin film transistor, wherein the to-be-treated portion of the transistor prototype is irradiated with ultraviolet light during the surface treatment by the supercritical fluid, wherein the supercritical fluid contains a cosolvent, wherein the transistor prototype is placed in a reaction chamber filled with the supercritical fluid during the surface treatment by the supercritical fluid, and wherein a ratio of a volume of the cosolvent to a volume of the reaction chamber is 1:100. |
地址 |
Kaohsiung TW |