| 摘要 |
The present invention relates to an adhesive pad manufacturing apparatus for forming an electromagnetic wave shielding film of a semiconductor package, and an adhesive pad manufacturing method using the same, and the adhesive pad manufacturing apparatus is a cluster structure based on a robot unit for transferring a tray, and comprises: a docking station for receiving the tray from the outside; a liquid adhesive applicator for transferring the tray of the docking station to the robot unit so as to apply, to the upper surface of the tray, a liquid adhesive for releasing a semiconductor package; a hardening device for heating the liquid adhesive applied to the upper surface of the tray so as to harden the liquid adhesive; and a cooling device for cooling the tray having the hardened liquid adhesive, thereby manufacturing an adhesive pad by using the liquid adhesive on the tray, so as to uniformly and flatly attach the semiconductor package when loading the semiconductor package. In addition, the adhesive pad manufacturing apparatus can reduce the damage of the semiconductor package by facilitating unloading of the semiconductor package and, as a cluster system, can reduce the overall size of equipment, facilitate additional expansions or reductions of the apparatus, and automate the entire process. |
