| 发明名称 |
Communication Module |
| 摘要 |
A communication module is mounted on a mother board provided in an electronic device and is thermally connected to a heat sink provided on the mother board. The communication module includes: a housing having a heat-dissipating surface thermally connected to a heat-absorbing surface of the heat sink; an elastic piece that presses the housing to the heat-absorbing surface; a module substrate accommodated in the housing; a plug connector protruding from the housing and inserted into and removed from a receptacle connector on the mother board; and a support member that supports the module substrate inside the housing. The module substrate is not in contact with the housing and is swingably supported with the support member as a support point. |
| 申请公布号 |
US2016150673(A1) |
申请公布日期 |
2016.05.26 |
| 申请号 |
US201514924767 |
申请日期 |
2015.10.28 |
| 申请人 |
Hitachi Metals, Ltd. |
发明人 |
SUNAGA Yoshinori |
| 分类号 |
H05K7/20;H05K7/10;H01R12/70 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A communication module mounted on a substrate provided in an electronic device, the communication module comprising:
a housing in which a module substrate is accommodated; a module connector that protrudes from the housing and is inserted into and removed from a connector on the substrate provided in the electronic device; and a support member that supports the module substrate inside the housing, wherein the module substrate is not in contact with the housing and is swingably supported with the support member as a support point. |
| 地址 |
Tokyo JP |
