| 摘要 |
PROBLEM TO BE SOLVED: To provide an encapsulation sheet with a separator, enabling a manufactured semiconductor device to have an excellent external appearance.SOLUTION: An encapsulation sheet 10 with a separator includes: a separator 16; and an encapsulation sheet 11 laminated on the separator 16. In the separator 16, a surface having contact with the encapsulation sheet 11 is treated with an aminoalkyd-based release agent. The peel strength between the encapsulation sheet 11 and the separator 16 is less than 0.4 N/100 mm width, after heated at 150°C for 1 hour. The encapsulation sheet 11 includes epoxy resin.SELECTED DRAWING: Figure 1 |
