| 摘要 |
PROBLEM TO BE SOLVED: To provide a component mounting device which can mount a component with high mounting efficiency on an upper surface of a long substrate in which a component is mounted on a lower surface thereof.SOLUTION: A component mounting device includes: a substrate transfer path 3 in which a plurality of substrate holding positions can be set; a backup pin 17; an upstream side head unit 33 which performs component mounting in a first mountable area A1; a downstream side head unit 34 which performs component mounting in a second mountable area A2; and a control device. The control device selects first and second substrate holding positions P1, P2 at which an existing backup pin 17 contacts a lower surface of a substrate 4 without interfering with a component on the lower surface of the substrate 4. The upstream side head unit 33 performs component mounting in the state in which a first substrate area B1 of the substrate 4 is positioned in the first mountable area A1. The downstream side head unit 34 performs component mounting in the state in which a second substrate area B2 of the substrate 4 is positioned in the second mountable area A2. |
