发明名称 防水型電子装置の製造方法
摘要 PROBLEM TO BE SOLVED: To solve such a problem that when constituting a housing section for housing an electronic device by assembling two members, sealant is scraped at a fitting portion if the protrusion of one member is fitted in the groove of the other member after filling the groove with the sealant, and the groove cannot be filled with a sufficient amount of sealant.SOLUTION: A housing body 1 and a connector member 2, becoming a housing constitution part, house an electronic device in conjunction. An encapsulation resin is pressure injected into gaps 9a, 9b, 9c between a groove 4b, i.e., a first fitting portion formed in the abutting surface of the housing body 1 and the connector member 2, and a protrusion 6c, i.e., a second fitting portion, and the air in the gaps 9a, 9b, 9c is sucked from a hole 4c, that is used as a resin filling confirmation window.
申请公布号 JP5925356(B2) 申请公布日期 2016.05.25
申请号 JP20150079833 申请日期 2015.04.09
申请人 三菱電機株式会社 发明人 ▲崎▼ 亮二;西川 英也
分类号 H05K5/02 主分类号 H05K5/02
代理机构 代理人
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