Semiconductor assembly and method for determining the barrier layer temperature of a semiconductor component

摘要

The semiconductor arrangement (2) has a semiconductor device (6) supported on a carrier (4) with a connecting surface (8). A contact area (12a) is arranged on the carrier. A bonding wire (10) is connected with the connecting surface with the contact area. An independent claim is also included for a method for determining of the junction temperature of a semiconductor device of a semiconductor arrangement.