发明名称 接合体の製造方法
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of producing a joint which enhances adhesion of an anisotropic conductive film by preventing oxidation of a connection terminal. <P>SOLUTION: An anisotropic conductive film 4 is arranged on a connection surface where an insulating film 3 covers above and between the connection terminals 2 of a first electronic component 1 flatly, and conductive particles penetrate the insulating film 3 above the connection terminals 2 thus attaining conduction. Consequently, oxidation of the connection terminals 2 can be prevented, adhesion of the anisotropic conductive film is enhanced and the temperature capable of temporary pasting can be lowered. Furthermore, short circuit between adjoining connection terminals can be prevented. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5924896(B2) 申请公布日期 2016.05.25
申请号 JP20110215091 申请日期 2011.09.29
申请人 デクセリアルズ株式会社 发明人 櫻井 茂喜;田巻 剛志;石松 朋之
分类号 H05K3/36;H05K1/14 主分类号 H05K3/36
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