发明名称 |
PACKAGING SUBSTRATE WITH BLOCK-TYPE VIA AND SEMICONDUCTOR PACKAGES HAVING THE SAME |
摘要 |
A packaging substrate (100) includes a core layer (200) having a first surface (200a) and a second surface (200b). A group of ground pads (210) is disposed on the second surface (200b) within a central region (101). A group of first power pads (220) is disposed on the second surface (200b) within the central region (101). A plurality of signal pads (240) is disposed on the second surface (200b) within a peripheral region (102) that encircles the central region (101). A first block-type via (110) is embedded in the core layer (200) within the central region (101). The group of ground pads (210) is electrically connected to the first block-type via (110). A second block-type via (120) is embedded in the core layer (200) within the central region (101). The group of first power pads (220) is electrically connected to the second block-type via (120). |
申请公布号 |
EP3024022(A1) |
申请公布日期 |
2016.05.25 |
申请号 |
EP20150192247 |
申请日期 |
2015.10.30 |
申请人 |
MEDIATEK, INC |
发明人 |
HSU, WEN-SUNG;CHEN, TAI-YU |
分类号 |
H01L23/367;H01L23/498;H01L23/50 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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