| 摘要 |
An optical film bonding position measurement device is provided which can measure them bonding position of an optical film easily and with high precision by capturing image data of an optical display device. This optical film bonding position measurement device measures the optical film bonding position in an optical display device which comprises an optical film bonded onto an optical element. This optical film bonding position measurement device is provided with a frame, an infrared light source which is provided on one end of the frame and emits infrared light, an imaging means which is provided on the other end of the frame and where the infrared light is incident, a ring light source which is provided between the infrared light source and the imaging means. The infrared light source and ring light source have substantially coaxial optical axes, and have light emission directions opposed to each other, with a space formed between the infrared light source and ring light source to allow passage of the optical display device. By means of this optical film bonding position measurement device, the bonding position of an optical film is measured using both an infrared light source and a ring light source, enabling highly accurate measurement with a simple structure. |
