THERMOELECTRIC MODULE

摘要

In a thermoelectric module according to an embodiment of the present invention, a first substrate is provided; a first electrode and a second electrode are provided on the first substrate; a first leg is provided on the first electrode; a second leg is provided on the second electrode; a third electrode is provided on the first and second leg; a second substrate is provided on the third electrode; first adhesive members are provided between the first substrate and the first electrode, and between the first substrate and the second electrode; second adhesive members are provided between the legs and the electrodes; and a third adhesive member is provided between the third electrode and the second substrate. At least one among the first to third adhesive members includes a first solder having an HCP. By using the first solder as an adhesive member, stability in a heat treatment process and a thermal operation range of the thermoelectric module can be increased, and conductivity and adhesiveness can be improved.