| 摘要 |
FIELD: metallurgy.SUBSTANCE: invention can be used in producing soldered structures from aluminium and its alloys. Solder contains component in following ratio, wt%: silicon 8-13, copper 0.1-10, germanium 1.5-8, iron 0.5-3, chromium 0.1-2.1, manganese 0.5-3, cobalt 0.001-0.8, molybdenum 0.001-0.8, strontium 0.001-0.2; beryllium 0.001-0.1, titanium 0.001-0.1, sodium 0.001-0.2, and vanadium 0.001-0.2, aluminium - balance. Total content of copper and germanium does not exceed 14 wt%. Ratio of iron to manganese is 1:1. Ratio of chromium to iron ranges from 1:1 to 1:1.2. During vacuum soldering solder additionally contains magnesium in amount of 0.1-1 wt%.EFFECT: invention provides low melting point solder, higher strength of soldered structures, which increases their service life.2 cl, 2 tbl, 3 ex |
