LASER CUTTING DEVICE

摘要

A laser cutting device is disclosed. The laser cutting device includes: a laser beam generating unit for emitting a laser beam; an optical system installed on a propagation path of the laser beam; a laser main body for providing a path through which the laser beam passing through the optical system travels, toward a substrate; a suctioning unit which is coupled to a header of the laser main body and suctions foreign matters; and a collecting unit which is connected to the suctioning unit and collects discharged foreign matters. The foreign matters are discharged into the collecting unit along a curved surface formed inside the suctioning unit. The laser cutting device according to an aspect of the present invention can easily remove foreign matters produced during cutting of a substrate.