发明名称 LASER SCRIBING METHOD AND FLAT PLATE MATERIAL HAVING DICING GROOVES
摘要 PROBLEM TO BE SOLVED: To provide a laser scribing method suitable for cutting a flat plate material such as ceramics or glass in spite of being a simple method and a flat plate material having dicing grooves.SOLUTION: A laser scribing method for scanning the surface of a flat plate material 5 with laser beams to form dicing grooves enables deep parts B to be formed locally in the groove length direction with intervals by locally reducing scan rate of the laser beams, with a ratio L2/L1 ranging over 0.005 or more and 0.5 or less when the full length including shallow parts and deep parts of the dicing grooves are L1, and the length of the deepest part is L2, and a ratio d2/d1 ranging over 1.5 or more and 5.0 or less when the depth of the shallowest part of the dicing grooves is d1, and the depth of the deepest part is d2.SELECTED DRAWING: Figure 1
申请公布号 JP2016083697(A) 申请公布日期 2016.05.19
申请号 JP20140220182 申请日期 2014.10.29
申请人 MITSUBISHI MATERIALS CORP 发明人 KUBO TAKUYA;HIGANO SATORU;TAKAHASHI MASAKUNI
分类号 B23K26/00;B23K26/364 主分类号 B23K26/00
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