发明名称 |
SEMICONDUCTOR DEVICE |
摘要 |
In order to improve the package body cracking resistance of an LSI package at the reflow soldering and to provide both a leadframe suitable for fabricating the LSI package according to the flexible manufacturing system and an LSI using the leadframe, the adhered area between a semiconductor chip 2 and a resin is enlarged by making the external size of a die pad 3 smaller than that of the semiconductor chip to be mounted thereon. Moreover, a variety of semiconductor chips 2 having different external sizes can be mounted on the die pad 3 by cutting the leading ends of leads 5 to a suitable length in accordance with the external sizes of the semiconductor chips 2. |
申请公布号 |
KR100548092(B1) |
申请公布日期 |
2006.01.24 |
申请号 |
KR20050087298 |
申请日期 |
2005.09.20 |
申请人 |
HITACHI, LTD.;HITACHI ULSI SYSTEMS CO., LTD. |
发明人 |
KAJIHARA YUJIRO;SUZUKI KAZUNARI;TSUBOSAKI KUNIHIRO;SUZUKI HIROMICHI;MIYAKI YOSHINORI;NAITO TAKAHIRO;KAWAI SUEO |
分类号 |
H01L23/495;H01L23/50;H01L21/48;H01L21/52;H01L21/60 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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