HEATING DEVICE, SUBSTRATE BONDING DEVICE, HEATING METHOD, AND METHOD OF MANUFACTURING LAMINATION SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent reduction in yield in a heating device.SOLUTION: A heating device comprises: a heating part for heating at least one of first and second substrates; and a controller for controlling a temperature of at least one of the first and second substrates to maintain a positional relation between the positioned first and second substrates. In the heating device, the controller may control the temperature by suppressing the heating to at least one of the first and second substrates.SELECTED DRAWING: Figure 10