发明名称 ARRANGEMENT AND METHOD FOR REINFORCING SUPPORTING STRUCTURES
摘要 The present disclosure relates to an arrangement having a supporting structure having a surface containing (e.g., consisting of) one or more faces, wherein a bore runs from at least one face into an inner region of the supporting structure, and this bore is filled with an adhesive and with a portion of a fibre bundle projecting beyond said face, wherein, on the at least one face, from which the bore runs into an inner region of the supporting structure, the supporting structure is provided with at least one groove which, starting from the bore, extends in at least one direction on the surface, and the projecting part of the fibre bundle is located, at least in part, in the at least one groove and is fastened therein by way of the adhesive.
申请公布号 US2016138285(A1) 申请公布日期 2016.05.19
申请号 US201414896284 申请日期 2014.06.06
申请人 SIKA TECHNOLOGY AG 发明人 BERSET Thierry
分类号 E04G23/02 主分类号 E04G23/02
代理机构 代理人
主权项 1. An arrangement comprising: a supporting structure with a surface consisting of one or more faces, wherein a bore runs from at least one face into an inner region of the supporting structure, and said bore is filled with an adhesive and with a portion of a fiber bundle projecting beyond said bore, wherein, on the at least one face from which the bore runs into an inner region of the supporting structure, the supporting structure is provided with at least one groove which extends from the bore in at least one direction on the surface, and the projecting part of the fiber bundle is at least partially located in the at least one groove and is fastened therein with adhesive.
地址 Baar CH
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