| 发明名称 |
BONDPLY ADHESIVE COMPOSITION |
| 摘要 |
The present disclosure is directed to a bondply adhesive. The bondply adhesive contains 85 to 99.5 wt % maleic anhydride grafted styrene ethylene butadiene styrene copolymer having greater than 1 wt % maleic anhydride, 0.4 to 3.0 wt % 3-glycidyloxypropyl-trimethoxysilane, and optionally up to 14 wt % organic flame retardant. |
| 申请公布号 |
US2016137889(A1) |
申请公布日期 |
2016.05.19 |
| 申请号 |
US201514943491 |
申请日期 |
2015.11.17 |
| 申请人 |
E I DU PONT DE NEMOURS AND COMPANY |
发明人 |
LI TUNG LIN |
| 分类号 |
C09J151/00 |
主分类号 |
C09J151/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A bondply adhesive consisting essentially thereof:
I. 85 to 99.5 wt % maleic anhydride grafted styrene ethylene butadiene styrene copolymer having greater than 1 wt % maleic anhydride; II. 0.4 to 3.0 wt % 3-glycidyloxypropyl-trimethoxysilane; and III. optionally up to 14 wt % organic flame retardant. |
| 地址 |
Wilmington DE US |
