| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element package and a semiconductor device that have a high reliability.SOLUTION: By provision of a thin part 3b in a frame member 3, a groove-like gap using the thin part 3b as a bottom part is formed at a contact position between the frame member 3 and a terminal member 4. Deformation by thermal expansion of the frame member 3 formed of a metal material is absorbed due to this gap, and a stress added to the terminal member 4 formed of a ceramic material is alleviated. As a result, generation of cracks and chipping on the terminal member 4 can be suppressed.SELECTED DRAWING: Figure 1 |
