| 摘要 |
PROBLEM TO BE SOLVED: To provide a high reliable wiring structure capable of reducing a stress which converges on the boundary between a via and the wiring when the temperature changes.SOLUTION: The wiring structure includes: a first wiring 1; a second wiring 2; and a via hole 3 that connects the first wiring and the second wiring to each other. The via hole contains a material 3A which is identical to the material of the first wiring and the second wiring and a material 3B which is different from the material of the first wiring or the second wiring. The ratio of the material, which is different from that of the material of the first wiring or second wiring, is arranged to be higher at the first wiring side and the second wiring side.SELECTED DRAWING: Figure 1 |
